The Oxford PlasmaPro 800 offers a compact size and open loading hardware, providing a flexible solution for reactive ion etching (RIE) processes on large wafers and 300 mm wafers. With its large wafer chuck, it enables batch processing at production scale and processing of single 300 mm wafers.

• Excellent substrate temperature control
• Precise process control
• Error analysis for 300 mm single wafer
• RIE/PE processes ranging up to 300 mm wafer etching, including packaged chip and die chip etching
• High-quality etching processes for SiNx and SiO2 for photonics, dielectric layer etching, and many other applications
• Etching of SiO2, SiNx, and quartz
• Etching of metals and polyamides
• Etching processes for III-V group semiconductor devices