The Oxford PlasmaPro 800 provides a compact solution with open loading hardware, suitable for Plasma Enhanced Chemical Vapor Deposition (PECVD) processes, especially on large wafer sizes, including 300 mm wafers. It features a 460 mm diameter chuck, enabling batch processing at production scale and processing of single 300 mm wafers.

• High-performance processes
• Excellent substrate temperature control
• Precise process control
• Error analysis for 300 mm single wafer