Oxford PlasmaPro 80, with its open loading hardware, offers versatile etching solutions in a compact, space-efficient system. It ensures high process quality without compromising ease of use. The open loading design allows for quick wafer loading and unloading, making it ideal for R&D, prototyping, and low-volume production. By utilizing optimized electrode cooling and excellent substrate temperature control, it delivers high-performance processes.

• Open loading design facilitates rapid wafer loading and unloading
• Excellent etch control and rate determination
• Superior wafer temperature uniformity
• Compatible with wafers up to 200 mm
• Low cost of ownership
• Manufactured to Semi S2/S8 standards
• Etching processes for III-V group semiconductor devices
• Silicon Bosch and cryo-etch processes
• Etching of SiO2 and quartz
• Hardmask etching for high-brightness LED production