The Oxford PlasmaPro 80 is a compact, space-efficient system that offers versatile etching and coating solutions with convenient open loading. It is easy to use without compromising on process quality. The open loading design allows for rapid wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. With optimized electrode cooling and excellent substrate temperature control, it provides high-performance processes.

• Open loading design enables quick wafer loading and unloading
• Excellent etch control and rate determination
• Superior wafer temperature uniformity
• Capable of handling wafers up to 200 mm
• Cost-effective
• Manufactured to Semi S2/S8 standards
• High-quality PECVD processes for silicon nitride and silicon dioxide for photonics, dielectric layers, passivation, and many other applications
• Hardmask coating and etching for high-brightness LED production