The Oxford PlasmaPro 80 is a compact, space-saving system offering versatile etching and deposition solutions with convenient open loading. It provides high-performance processes without compromising on quality and is easy to use. The open loading design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. It features optimized electrode cooling and excellent substrate temperature control for high-performance processes.

• Open loading design allows for quick wafer loading and unloading
• Excellent etch control and rate determination
• Superior wafer temperature uniformity
• Capable of handling wafers up to 200 mm
• Low cost
• Manufactured to Semi S2/S8 standards
• Etching processes for III-V group semiconductor devices
• Silicon Bosch and cryo-etch processes
• Diamond-Like Carbon (DLC) coating
• Etching of SiO2 and quartz
• High-quality PECVD processes for silicon nitride and silicon dioxide for photonics, dielectric layers, passivation, and many other applications
• Hardmask coating and etching for high-brightness LED manufacturing