The Oxford PlasmaPro 100 Estrelas platform is designed to provide complete flexibility for Deep Silicon Etch (DSiE) applications, catering to various process requirements in the MEMS, Advanced Packaging, and Nanotechnology markets. Developed for both R&D and high-volume production, the Oxford PlasmaPro 100 Estrelas offers maximum flexibility in Bosch and Cryogenic processes.

• High etch rate and high selectivity with the Bosch process
• Smooth sidewalls and high aspect ratio processes
• Highly anisotropic (vertical) profile
• Low power and low etch rate for nano-silicon etching and notch control (SOI)
• Tapered via hole creation
• Wide range of applications
• Compatibility with mechanical or electrostatic clamping (substrates)
• Enhanced repeatability
• Increased mean time between cleans (MTBC)