The Oxford PlasmaPro 100 ALE provides precise etch process control for next-generation semiconductor devices. Specially designed for processes such as recess etch for GaN HEMT applications and nanoscale layer etching, the system’s digital/cyclic etch process delivers low-damage, smooth surfaces.

• Digital/Cyclic etch process
• Low damage
• Smooth etch surface
• Excellent etch depth control
• Ideal for nanoscale layer etching (e.g., 2D Materials)
• Wide range of processes and applications