The Oxford Ion Beam Etching (IBE) and Deposition (IBD) system is a popular choice for high-quality material processing. Our systems offer flexible hardware options, including open loading, single substrate loading chamber, and cassette-to-cassette loading. System features can be adjusted according to applications to provide faster and more repeatable process results.

• Multi-mode capability
• Cluster integration with other plasma etching and deposition systems
• Single wafer loading or cluster wafer processing
• Dual-beam configuration
• Very low film surface roughness
• High batch uniformity and process repeatability
• Accurate endpoint detection – SIMS, optical emission
• High-quality thin films with ultra-low contamination
• High throughput with reduced equipment size for low operating cost
• Patented high-speed substrate holder (up to 500 RPM)
• Highly precise integrated optical film control