The Oxford FlexAL atomic layer deposition (ALD) system offers optimized high-quality plasma ALD and thermal ALD processes with maximum flexibility in a wide range of configurations, including the precursors used, process gases, and a single process chamber.

• Remote plasma feature for low-damage plasma ALD along with Oxford thermal ALD in a single deposition chamber
• RF-powered electrode option available for control of film properties
• Provides cassette-to-cassette processing capability, an industry standard, for higher throughput
• Maximum flexibility in the selection of precursors, process gases, and hardware features
• Optimized with low-damage process technology to protect high-quality substrates
• Low-temperature technology ensures high-quality deposition on temperature-sensitive surfaces